北京清华大学高精尖研究中心
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Case esearch Achievements
说明: The “12thFive-Year Plan” Science and Technology Innovation Achievement Exhibition under the theme of “Innovation-Driven Development, and Science &Technology Leading the Future” was held at Beijing Exhibition Centre in June 2016. NS-2 (Nano Satellite 2), developed by Beijing Future Chip Technology Innovation Center and representing Tsinghua University’s scientific research achievements during the“12th Five-year Plan” period, made its appearance at the exhibition. The satellite, developed by the team headed by You Zheng, an academician of Chinese Academy of Engineering, is a university satellite in a real sense, with the participation of graduate students in the whole process from development to measurement and control. A 20kg-class satellite developed by Tsinghua University, NS-2 p...
说明: Recently, the Center’s research group headed by Prof. Wang Yayu published the latest research results entitled “Visualizing the evolution from the Mott insulator to a charge ordered insulator in lightly doped cuprates” in the magazine Nature Physics. The research team led by Prof. Wang Yayu developed scanning tunneling microscope (STM) capable of measuring insulating oxides. It is used to make experimental study of Bi2Sr2-xLaxCuO6+d copper oxide system extremely lacking adulteration. It systemically reveals the evolution trend of the electronic structure depending on the density of adulteration. This study provides a new valuable clue to understand the evolution of the electronic structure of copper oxide superconductors, the formation mechanism of charge ordered state and its relationship...
说明: Recently, the Center’s research team headed by Prof. Liu Yongpan and Prof. Yang Huazhong has completed the development of a non-volatile processor chip based on resistive memory device. By introducing the vertically stacked nvSRAM architecture and automatic write termination circuit technology, it increases the running speed 6 times, and its wake-up speed reaches 20ns – the highest indicators in the world’s research reports. The result was published at the 2016 International Solid-State Circuits Conference (ISSCC). ISSCC, the world’s largest and highest-level international conference on solid-state circuit, is known as the “Integrated Circuit Olympiad”. This paper is the only one from a university in mainland China this year.
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